HK

Hideki Kono

DI Daikin Industries: 2 patents #113 of 614Top 20%
TU Tsinghua University: 1 patents #105 of 442Top 25%
📍 Osaka, AL: #2 of 2 inventorsTop 100%
Overall (2024): #161,642 of 561,600Top 30%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12180358 Fluorine-containing resin composition and method for production thereof Xuming Xie, Masaji Komori 2024-12-31
11939450 Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board Hirofumi MUKAE, Hirokazu Komori, Masaji Komori, Ayane NAKAUE 2024-03-26