Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12120816 | Micro-roughened electrodeposited copper foil and copper clad laminate | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2024-10-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12120816 | Micro-roughened electrodeposited copper foil and copper clad laminate | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2024-10-15 |