HH

Hung-Wei Hsu

CD Co-Tech Development: 1 patents #1 of 4Top 25%
Overall (2024): #439,641 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12120816 Micro-roughened electrodeposited copper foil and copper clad laminate Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao 2024-10-15