Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12110430 | Adhesive composition, and production method thereof | Ji Ho Hwang, Young Lyeol Yang, Chang Yub OH, Kyung Su Na, Jun Ok Moon | 2024-10-08 |
| 12110431 | Adhesive composition and preparation method therefor | Ji Ho Hwang, Young Lyeol Yang, Chang Yub OH, Kyung Su Na, Jun Ok Moon | 2024-10-08 |
| 12077681 | CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same | Ji Ho LEE, Young-Gi LEE, Soo Yeon SIM, Hyun Woo Lee, Jong Won Lee | 2024-09-03 |
| 12018047 | Method for producing N-acetyl dipeptide and N-acetyl amino acid | Joo Young Lee, Jin-Woo Jeon, Jun Ok Moon, Jin Seung Park | 2024-06-25 |