| #140 |
Peilin Li |
Honeywell |
4 |
| #140 |
Xin Wen |
Eastman Kodak |
4 |
| #140 |
Yafei Yang |
Qualcomm |
4 |
| #140 |
Xiaohan Chen |
Huawei |
4 |
| #140 |
Li Li |
Electronic Arts |
4 |
| #140 |
Chenghao Liu |
Tencent |
4 |
| #140 |
Jiaqi Zhang |
Black & Decker |
4 |
| #140 |
Xiaowei Wang |
Cisco |
4 |
| #140 |
Jun Zhou |
Alipay (Hangzhou) Information Technology Co. |
4 |
| #140 |
Hui Guo |
Tencent |
4 |
| #140 |
Wen Jiang |
Dell Products |
4 |
| #140 |
Xin Wang |
Johnson Electric S.A. |
4 |
| #140 |
Tong Zheng |
Black & Decker |
4 |
| #140 |
Chuang Li |
Unknown |
4 |
| #140 |
Shan Dong Su |
Tencent |
4 |
| #140 |
Jinhong Wu |
Samsung |
4 |
| #140 |
Jennifer Wu |
Weider Metal |
4 |
| #140 |
Jian Li |
Caltech |
4 |
| #140 |
Qianyu Zhang |
Google |
4 |
| #140 |
Mingshan Wang |
Shenzhen Anker Smart Technology Co. |
4 |
| #140 |
Wei Lin |
Zte |
4 |
| #140 |
Bo Peng |
Globalfoundries U.S. |
4 |
| #173 |
Jian Zhao |
Johnson Electric S.A. |
3 |
| #173 |
Wenjie Jiang |
Arashi Vision |
3 |
| #173 |
Changzheng Su |
Huawei |
3 |
| #173 |
Yuling Chen |
Dell Products |
3 |
| #173 |
Bin Chen |
Black Sesame Technologies |
3 |
| #173 |
Jiachen Yang |
— |
3 |
| #173 |
Yikang Deng |
Intel |
3 |
| #173 |
Rui Shi |
Huawei |
3 |
| #173 |
Alex William Chow |
Campfire 3D |
3 |
| #173 |
Weifeng Zhang |
IBM |
3 |
| #173 |
Hongtao Chen |
Huawei |
3 |
| #173 |
Wei Wang |
Moffett Technologies Co., Limited |
3 |
| #173 |
Xiaochun Zhu |
Qualcomm |
3 |
| #173 |
Xudong Shi |
Rambus |
3 |
| #173 |
Kefeng Zhou |
Tilta |
3 |
| #173 |
Yunliang Zhu |
Qualcomm |
3 |
| #173 |
Yu PAN |
Zte |
3 |
| #173 |
Wentao Zhang |
Disney |
3 |
| #173 |
Ke Liu |
HP |
3 |
| #173 |
Zheng Li |
Texas Instruments |
3 |
| #173 |
Yi Wei |
OPPO |
3 |
| #173 |
Weibin Chen |
Seagate Technology |
3 |
| #173 |
Bo Li |
Black Sesame Technologies |
3 |
| #173 |
Yongbing Guo |
Rubrik |
3 |
| #173 |
Shu Lu |
Intertec Technology Limited |
3 |
| #173 |
Tao Shi |
Huawei |
3 |
| #173 |
Yang Chen |
Hrl Laboratories |
3 |
| #173 |
Wenhai Liu |
Caltech |
3 |