Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062539 | Semiconductor-on-insulator (SOI) substrate and method for forming | Cheng-Ta Wu, Chia-Ta Hsieh, Yu-Chun Chang, Ying Ling Tseng | 2024-08-13 |
| 11892282 | Protective film thickness measuring method | Hiroto Yoshida, Nobuyasu Kitahara, Kunimitsu Takahashi, Naoki MURAZAWA, Joel Koerwer | 2024-02-06 |