Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159792 | Flip chip package unit comprising thermal protection film and associated packaging method | Hunt Hang Jiang, Xiuhong Guo | 2024-12-03 |
| 12002787 | Multi-die package structure and multi-die co-packing method | Hunt Hang Jiang | 2024-06-04 |