Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159792 | Flip chip package unit comprising thermal protection film and associated packaging method | Yingjiang Pu, Hunt Hang Jiang | 2024-12-03 |
| 11860597 | Smart switch system | Xingwei Wang, Cheng-Chung Yang, I-Fan Chen | 2024-01-02 |