Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12055586 | 3D stacked die testing structure | Sagar Kumar, Rajesh Khurana | 2024-08-06 |
| 11947887 | Test-point flop sharing with improved testability in a circuit design | Krishna Vijaya Chakravadhanula, Brian Foutz, Prateek Kumar Rai, Sarthak Singhal, Christos Papameletis | 2024-04-02 |