Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942372 | Dielectric protection layer in middle-of-line interconnect structure manufacturing method | Kuan Da Huang, Li-Te Lin | 2024-03-26 |
| 11901176 | Semiconductor arrangement and method for making | Yi-Shan Chen | 2024-02-13 |