Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134834 | Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent | Marco Arnold, Alexander FLUEGEL, Charlotte Emnet | 2024-11-05 |
| 12098473 | Composition for cobalt plating comprising additive for void-free submicron feature filling | Sathana Kitayaporn, Charlotte Emnet, Dieter Mayer, Marco Arnold, Lucas Benjamin HENDERSON +1 more | 2024-09-24 |