Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134834 | Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent | Alexander FLUEGEL, Charlotte Emnet, Nadine ENGELHARDT | 2024-11-05 |
| 12098473 | Composition for cobalt plating comprising additive for void-free submicron feature filling | Sathana Kitayaporn, Charlotte Emnet, Dieter Mayer, Nadine ENGELHARDT, Lucas Benjamin HENDERSON +1 more | 2024-09-24 |
| 12054842 | Composition for tin-silver alloy electroplating comprising a complexing agent | Katharina Fritzsche, Doris KREMZOW-GRAW, Alexander FLUEGEL | 2024-08-06 |
| 11926918 | Composition for metal plating comprising suppressing agent for void free filing | Marcel Patrik KIENLE, Dieter Mayer, Alexandra Haag, Charlotte Emnet, Alexander FLUEGEL | 2024-03-12 |