Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113032 | Substrate having undercut portion for stress mitigation | Chris Y. Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi, Sarah Haney +1 more | 2024-10-08 |
| 12002741 | Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths | Michael Leary, Ah Ron Lee, Chris Y. Chung, Domingo Figueredo | 2024-06-04 |