Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002741 | Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths | Michael Leary, Chris Y. Chung, YongIk Choi, Domingo Figueredo | 2024-06-04 |