Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11958162 | CMP pad construction with composite material properties using additive manufacturing processes | Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Fred C. Redeker +4 more | 2024-04-16 |