Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027472 | Integrated circuit packages to minimize stress on a semiconductor die | Ramji Sitaraman Lakshmanan, Bernard Patrick Stenson, Padraig L. Fitzgerald, Michael James Twohig, Michael John Flynn +1 more | 2024-07-02 |