Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172168 | Thermal platform and a method of fabricating a thermal platform | Christophe Antoine, Helen Berney, Bernard Patrick Stenson, William Allan Lane, Himanshu Jain +5 more | 2024-12-24 |
| 12027472 | Integrated circuit packages to minimize stress on a semiconductor die | Bernard Patrick Stenson, Padraig L. Fitzgerald, Oliver Kierse, Michael James Twohig, Michael John Flynn +1 more | 2024-07-02 |