Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113331 | System and apparatus for sequential transient liquid phase bonding | Pradeep Srinivasan, Kevin Masuda, Wenjing Liang | 2024-10-08 |
| 11860308 | Chip packaging in light detection and ranging (LIDAR) sensor system | Colin Delaney, James Ferrara, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu +2 more | 2024-01-02 |