Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11953628 | Heat dissipation in an optical device | Sen Lin | 2024-04-09 |
| 11860308 | Chip packaging in light detection and ranging (LIDAR) sensor system | Colin Delaney, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu, YongXuan Liang +2 more | 2024-01-02 |