Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183712 | Method and system for manufacturing a semiconductor package structure | Che-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Chih-Hsiang Hsu | 2024-12-31 |
| 12156271 | Apparatuses and methods for expedited tunnel establishment with a non-third generation partnership project (3GPP) interworking gateway to access a 3GPP network | Hui-Ling Chang, Yuan-Chieh Lin | 2024-11-26 |