Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183712 | Method and system for manufacturing a semiconductor package structure | Che-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee | 2024-12-31 |
| 12183781 | Power semiconductor packaging and manufacturing method thereof | Tao Long, Pin-Hao Huang, Peng Chen | 2024-12-31 |
| 12102171 | Supporting member for footwear activity economy | Kurt Stockbridge, Anthony C. Dean, Geoffrey Gray | 2024-10-01 |
| 11900150 | Methods and systems for collection of system management interrupt data | Wei Li, Shang-Lin Tsai, Lueh-Chih Fang | 2024-02-13 |