Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100697 | Semiconductor package structure | Cheng-Hsuan Wu | 2024-09-24 |
| 11942585 | Optoelectronic package structure and method of manufacturing the same | Cheng-Hsuan Wu, Yu-Sheng Huang | 2024-03-26 |