Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848375 | IGBT chip having folded composite gate structure | Chunlin Zhu, Liheng Zhu | 2023-12-19 |
| 11630144 | In-situ monitoring method and apparatus for power electronic device explosion | Sheng Liu, Zhiwen Chen, Fang Dong, Li Liu | 2023-04-18 |