Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842911 | Wafer stress control using backside film deposition and laser anneal | Pengan Yin, Shu Wu, Lina Miao | 2023-12-12 |
| 11798913 | Metal-dielectric bonding method and structure | — | 2023-10-24 |