Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721686 | Semiconductor package structure and packaging method thereof | Peng Chen, Xinru Zeng | 2023-08-08 |
| 11694904 | Substrate structure, and fabrication and packaging methods thereof | Xinru Zeng, Peng Chen | 2023-07-04 |
| 11688721 | Chip package structure and manufacturing method thereof | Xinru Zeng, Peng Chen | 2023-06-27 |