Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11686637 | Silicon carbide-based combined temperature-pressure micro-electro-mechanical system (MEMS) sensor chip and preparation method thereof | Xudong Fang, Ziyan FANG, Chen WU, Hao Sun, Libo Zhao +6 more | 2023-06-27 |
| 11598676 | Tungsten-rhenium composite thin film thermocouple based on surface micropillar array with gas holes | Zhongkai ZHANG, Bingfei ZHANG, Jiangjiang Liu, Zhaojun Liu, Libo Zhao | 2023-03-07 |