Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804463 | Underfill for chip packaging and chip packaging structure | De Wu, Shengquan Wang, Yi-Ching Wang, Shuhang Liao | 2023-10-31 |
| 11767450 | Adhesive, die attach film and preparation method therefor | De Wu, Shuhang Liao, Ting Li, Yi-Ching Wang | 2023-09-26 |
| 11643499 | Liquid molding compound for protecting five edges of semiconductor chip and preparation method thereof | De Wu, Shuhang Liao, Yi-Ching Wang, Shengquan Wang | 2023-05-09 |