Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610821 | Method for forming a semiconductor device involving the use of stressor layer | Wen Yi Tan | 2023-03-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610821 | Method for forming a semiconductor device involving the use of stressor layer | Wen Yi Tan | 2023-03-21 |