Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764075 | Package assembly for plating with selective molding | Huiying Ding, Junfeng Liu, Longnan Jin, Thomas Schmidt | 2023-09-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764075 | Package assembly for plating with selective molding | Huiying Ding, Junfeng Liu, Longnan Jin, Thomas Schmidt | 2023-09-19 |