SL

Sheng-Yuan Lee

VL Via Labs: 2 patents #1 of 18Top 6%
📍 New Taipei, MD: #3 of 4 inventorsTop 75%
Overall (2023): #108,980 of 537,848Top 25%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11735502 Integrated circuit chip, package substrate and electronic assembly 2023-08-22
11605590 Multilayer-type on-chip inductor structure 2023-03-14