Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600612 | Switch chip with bond wires replacing traces in a die | Didmin Shih, Tengyi Huang, Yen-Wei WU | 2023-03-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600612 | Switch chip with bond wires replacing traces in a die | Didmin Shih, Tengyi Huang, Yen-Wei WU | 2023-03-07 |