Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804416 | Semiconductor device and method of forming protective layer around cavity of semiconductor die | Saravuth Sirinorakul, Preecha Joymak, Natawat Kasikornrungroj, Wasu Aingkaew, Kawin Saiubol | 2023-10-31 |
| 11710681 | Semiconductor packages and methods of packaging semiconductor devices | Tanawan Chaowasakoo, Hua Tan, Alexander Lucero Laylo | 2023-07-25 |