Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710661 | Semiconductor packages and methods of packaging semiconductor devices | Enrique Jr Sarile, Seung Geun Park, Ronnie M. De Villa, Zhong Hai Wang | 2023-07-25 |
| 11670549 | Semiconductor packages without debris | Enrique Jr Sarile, Seung Geun Park | 2023-06-06 |