Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621349 | Nano-wall integrated circuit structure with high integrated density | Ping Li, Yongbo Liao, Xianghe Zeng, Yaosen Li, Ke Feng +4 more | 2023-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621349 | Nano-wall integrated circuit structure with high integrated density | Ping Li, Yongbo Liao, Xianghe Zeng, Yaosen Li, Ke Feng +4 more | 2023-04-04 |