Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11553602 | Method for manufacturing circuit board with heat dissipation function | Jing Yang, Yen-Chang Chu | 2023-01-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11553602 | Method for manufacturing circuit board with heat dissipation function | Jing Yang, Yen-Chang Chu | 2023-01-10 |