Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545935 | Oscillator wafer-level-package structure | Chih-Hsun Chu, Wun-Kai Wang, HSIANG-JEN CHENG | 2023-01-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545935 | Oscillator wafer-level-package structure | Chih-Hsun Chu, Wun-Kai Wang, HSIANG-JEN CHENG | 2023-01-03 |