Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11711885 | Method of manufacturing printed circuit board assemblies with engineered thermal paths | Rick Bauer, Jerrad Martinson, Shane Hoffstatter, Doyle Laudal, Mike Lugert | 2023-07-25 |