Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545419 | Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals | Takahiro HIRANO, Arata Harada, Tomomi Okumura, Keita FUKUTANI, Masayoshi Nishihata | 2023-01-03 |