Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11825594 | Semiconductor device having electric component built in circuit board | — | 2023-11-21 |
| 11802739 | Cooling assemblies having channels to supply fluid to wick structures | Feng Zhou, Danny J. Lohan, Shailesh N. Joshi, Hitoshi Fujioka, Hiroshi Ukegawa | 2023-10-31 |
| 11776875 | Systems including a vapor chamber as the heat spreading substrate of a power device embedded in a PCB and methods of forming the same | Feng Zhou, Hiroshi Ukegawa | 2023-10-03 |
| 11665813 | Power electronics cooling assemblies and methods for making the same | Feng Zhou | 2023-05-30 |
| 11602087 | Double-sided hybrid cooling of PCB embedded power electronics and capacitors | Feng Zhou, Shailesh N. Joshi, Hitoshi Fujioka, Danny J. Lohan, Hiroshi Ukegawa +1 more | 2023-03-07 |