MI

Masakazu Ishikawa

LI Lintec: 3 patents #1 of 31Top 4%
📍 Hiroshima, JP: #3 of 10 inventorsTop 30%
Overall (2023): #69,497 of 537,848Top 15%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11673340 Dielectric-heating bonding film and bonding method using dielectric-heating bonding film 2023-06-13
11541607 Dielectric-heating bonding film and bonding method using dielectric-heating bonding film 2023-01-03
11542415 High-frequency dielectric heating adhesive sheet, and adhesion method in which same is used 2023-01-03