Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11794252 | Lamination molding method and lamination molding system | Ichiro ARAIE, Toshio Kaji, Yasuyuki MIYASHITA | 2023-10-24 |
| 11646518 | Connector with a contact retained in a housing | Junya Tsuji | 2023-05-09 |