Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804466 | Substrate processing apparatus, substrate processing method and bonding method | — | 2023-10-31 |
| 11658146 | Bonding apparatus, bonding system, bonding method, and recording medium | Takashi Nakamitsu, Shuhei Matsumoto | 2023-05-23 |
| 11545383 | Substrate positioning apparatus, substrate positioning method, and bonding apparatus | Tetsuya Maki | 2023-01-03 |