Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839160 | Wafer-level manufacturing process of a flexible integrated array sensor | Miao Wang, Weimong Tsang, Wenlong JIAO, Ruifeng Yang | 2023-12-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839160 | Wafer-level manufacturing process of a flexible integrated array sensor | Miao Wang, Weimong Tsang, Wenlong JIAO, Ruifeng Yang | 2023-12-05 |