Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581446 | Semiconductor device including an electrically conductive adhesive layer and a bypass diode in a carrier | Eric M. Rehder, Xiaobo ZHANG, Joseph C. Boisvert | 2023-02-14 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581446 | Semiconductor device including an electrically conductive adhesive layer and a bypass diode in a carrier | Eric M. Rehder, Xiaobo ZHANG, Joseph C. Boisvert | 2023-02-14 |