Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581446 | Semiconductor device including an electrically conductive adhesive layer and a bypass diode in a carrier | Eric M. Rehder, Xiaobo ZHANG, Peichen Pien | 2023-02-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581446 | Semiconductor device including an electrically conductive adhesive layer and a bypass diode in a carrier | Eric M. Rehder, Xiaobo ZHANG, Peichen Pien | 2023-02-14 |