Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804382 | Method of forming package substrate with partially recessed capacitor | Jaimal Mallory Williamson | 2023-10-31 |
| 11800636 | Electronic substrate having differential coaxial vias | Tapobrata Bandyopadhyay, Markarand Ramkrishna Kulkarni | 2023-10-24 |