Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742208 | Method of reducing voids and seams in trench structures by forming semi-amorphous polysilicon | Jonathan Philip Davis, Azghar H Khazi-Syed, Shariq Arshad, Khanh Quang Le, Kaneez Eshaher Banu +3 more | 2023-08-29 |