Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791289 | Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die | Bob Lee, YuhHarng Chien | 2023-10-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791289 | Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die | Bob Lee, YuhHarng Chien | 2023-10-17 |