Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837529 | Semiconductor package with top circuit and an IC with a gap over the IC | Paul Merle Emerson, Sandeep Krishnan | 2023-12-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837529 | Semiconductor package with top circuit and an IC with a gap over the IC | Paul Merle Emerson, Sandeep Krishnan | 2023-12-05 |