Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764392 | Battery assembly and method of manufacturing the same | Kelvin Po Leung Pun, Vikram Venkatadri, David Bolognia | 2023-09-19 |
| 11749595 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Kelvin Po Leung Pun | 2023-09-05 |
| 11594509 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Kelvin Po Leung Pun | 2023-02-28 |
| 11553598 | Integrated electro-optical flexible circuit board | Kelvin Po Leung Pun, Jason Rotanson | 2023-01-10 |